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Your project will be thermal analysis of a Flipchip package. You need to perform
Your project will be thermal analysis of a Flipchip package. You need to perform the following parametric studies to find
1) maximum temperature,
2) Convection Heat dissipation path on the lid and substrate,
3) radiation heat dissipation on the lid
4) Temperature through-the-thickness of the package
prepare your IEEE report. Take a look at sample papers to get some idea how to write your reports
Material parametric study:
-Solder type: SAC305 vs SnCu (note: all of these materials are already defined in the Engineering Data of the project)
-Underfill: UF1 vs UF2 vs UF3 (note: all of these materials are already defined in the Engineering Data of the project)
-Lid material: Copper vs Stainless steel vs Aluminum): (note: Copper and Stainless steel are already defined in the Engineering Data of the project and you need to define Aluminum by yourself)
-TIM thermal conductivity (.1 vs .3 vs .5) W/m-K
Loading parametric study:
-Uniform Power (Heat flow): (5,10, and 20W) (note, Default value applied in the demo is 10W)
-Convection coefficient value: 10 vs 100 vs 1000 W/(m2 K) (default value in the demo is 100 W/(m2 K)
-radiation emissivity (0.2 vs 0.4 vs 0.6) (default value in the demo is 0.2)
Geometry parametric study:
Lid Thickness: (1.25, 1.5, 2mm), demo: 1.25
TIM thickness: (50, 75, 100 um), demo: 50um (note: keep lid thickness 1.25 in this case)
Substrate core thickness: 0.41, 0.5, 0.6, demo is 0.41. Note: keep the total substrate thickness the same and change the core thickness only and therefore you need to reduce the build up thickness on both side)
Bulk silicon thickness: (0.7, 0.5, 0.3), demo value is 0.7 (do not change the lid thickness of 1.25, shift the lid to bottom when using thinner die)
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